Heat dissipating apparatus
US7286353B2 · kind B2 · utility
4Cited by
23References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 3, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Dec 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus includes a heat sink (20) having a base plate (22) for contacting an electronic component (10). A number of main fins (24) extend from the base plate. A cooling fan (30) is mounted on the heat sink. A center of the cooling fan offsets in a first direction from a center of the electronic component, so that a portion of the cooling fan that generates more and stronger airflows than the center of the cooling fan does is aligned with the center of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.