Surface mounted resistor with improved thermal resistance characteristics
US7286358B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | May 1, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.