Heat dissipating apparatus
US7286362B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 25, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Jan 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating apparatus includes a retention module (20) forming clipping portions (26) thereon, a heat sink (10) mounted to the retention module, and a clip (30) engaged with the retention module and the heat sink. The clip includes a resilient clipping member (32) clasped with the clipping portions, and an operating member (34) pivotally mounted to the clipping member. The operating member includes a longitudinal pole (340) rotating about an axis thereof. The longitudinal pole forms a supporting portion (341) to support the clipping member away from the retention module in the process of its rotation from unlock to lock position. At the lock position, the clipping member securely engages with the clipping portions of the retention module, and the heat sink is downwardly pressed by the longitudinal pole to have an intimate contact with a heat generating component (8).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.