Electronic substrate for a three-dimensional electronic module
US7286365B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an electronic substrate suitable for being included in a stack containing said electronic substrate and at least one other electronic substrate and suitable for being connected to the other electronic substrate and optionally to an input-output interface, wherein it comprises a frame consisting of a material with a high thermal conductivity comprising a plurality of sides, a first side of which is intended to be in contact with the corresponding side of the frame of another neighboring substrate so as to provide thermal dissipation of the electronic substrates and a second side of which comprises an interconnection element intended to provide electrical interconnection between said electronic substrate and the other electronic substrate(s) by means of a routing circuit between said electronic substrate and the input-output interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.