Multilayer circuit board with embedded components and method of manufacture
US7286366B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Jan 18, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49139
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12 and 16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67 & 66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.