High-density memory module utilizing low-density memory components
US7286436B2 · kind B2 · utility
184Cited by
12References
20Claims
0Family size
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Key dates
| Filing date | Mar 7, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | May 15, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C2207/105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory module comprises a plurality of memory components. Each memory component has a first bit width. The plurality of memory components are configured as one or more pairs of memory components. Each pair of memory components simulates a single virtual memory component having a second bit width which is twice the first bit width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.