Multi-layer board manufacturing method
US7287321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.