Processing method, manufacturing method of semiconductor device, and processing apparatus
US7288466B2 · kind B2 · utility
6Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 14, 2003 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | May 14, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/949
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.