Method and system for performing die attach using a flame
US7288472B2 · kind B2 · utility
1Cited by
14References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2004 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Dec 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a method for attaching a die to a substrate using a flame or other heat source are disclosed. The flame may be produced by combustible gas. Also disclosed are embodiments of a system for performing die attach using a flame. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.