Poly(phenylene oxide) resin composition, prepreg, laminates sheet, printed wiring board, and multilayer printed wiring board
US7288587B2 · kind B2 · utility
14Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2002 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.