Adhesives with improved die-cutting performance
US7288590B2 · kind B2 · utility
25Cited by
19References
9Claims
0Family size
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Key dates
| Filing date | Jun 26, 2001 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Jun 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Improved adhesives are provided through the use of styrenic tetrablock or pentablock copolymers which have a reduced elastomeric behavior under the die-cutting conditions used in label production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.