Grounding device for bundled cables
US7288720B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2006 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Sep 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R9/2483
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.