Electronic package and packaging method
US7288728B2 · kind B2 · utility
5Cited by
3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2006 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Jan 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first substrate includes a coil assembly and an integrated circuit mounted thereon. A second substrate includes capacitors 16 and resistors mounted thereon. The first substrate and the second substrate are interconnected by an encapsulating medium. A conductive via is provided to electrically connect the first substrate and the second substrate together
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.