Method of forming an opening or cavity in a substrate for receiving an electronic component
US7288739B2 · kind B2 · utility
5Cited by
17References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 2, 2005 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Mar 2, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an opening or cavity in a substrate, for receiving an electronic component, consists of or includes providing a patterned opaque masking layer on or adjacent a first major surface of the substrate, the masking layer having an opening overlying the position where the cavity is to be made, removing material from the substrate by laser ablation through the opening thereby forming an opening or cavity of a suitable size for receiving said electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.