Patent · US Active

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

US7288831B2 · kind B2 · utility

1Cited by

45References

31Claims

0Family size

Assignee

OSRAM GmbH · DE

Inventors

Guenther Waitl · Regensburg, DE
Franz Schellhorn · Regensburg, DE
Herbert Brunner · Sinzing, DE

Key dates

Filing date	Aug 8, 2006
Grant date	Oct 30, 2007
Priority date	—
Expiry date	Aug 8, 2026

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.