Multi-chip module with power system and pass-thru holes
US7289328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2004 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Apr 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.