Mirror image electrical packages and system for using same
US7289332B2 · kind B2 · utility
3Cited by
15References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2004 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Jun 15, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mirror image package is disclosed along with several embodiments for using such package in connection with a normal package. Embodiments include side-by-side and top-over-bottom mounting arrangements. Embodiments also include color or graphic coding so that normal and mirror image chips may be easily distinguished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.