Electronic packaging and method of making the same
US7289336B2 · kind B2 · utility
13Cited by
5References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2004 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Sep 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.