Method and apparatus for prediction of polishing condition, and computer product
US7289872B1 · kind B1 · utility
1Cited by
5References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45232
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing-condition predicting apparatus determines optimum parameters to be substituted into various function models by performing calibration by use of a TEG. A polishing condition enabling polishing of a thin film formed on a substrate to be designed so as to obtain a desirable height of the thin film and a desirable depth of a groove is predicted by simulation using the determined optimum parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.