Method of manufacturing optical modulator
US7290328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2004 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Dec 14, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Major surface of a substrate having an optical waveguide and a modulation electrode is pasted to a base substrate through a thermosetting resin, and then the rear surface of the substrate is machined thus making thin the entirety. Subsequently, the rear surface of the substrate thus rendered thin is subjected to machining or laser machining to form a thin part, which is further subjected to machining or laser machining to form a first thin part at a part, including the optical waveguide, of the thin part and a second thin part thinner than the first thin part contiguously thereto. Thereafter, the rear surface of the substrate is pasted to the major surface of a supporting substrate through a thermosetting resin and the base substrate is stripped thus obtaining an optical modulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.