Heater chips with a reduced number of bondpads
US7290864B2 · kind B2 · utility
3Cited by
13References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14072
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Heater chips for use in printing devices, such as those including one or more ink vias and one or more heater arrays, where at least a portion of at least one the ink vias is associated with at least portions of at least two heater arrays. The first heater array can be adjacent to one side of at least a portion of the ink via and a second heater array can be adjacent to another side of at least a portion of the ink via. The heater chip can also include a bondpad supplying power to at least a portion of the first heater array and to at least a portion of the second heater array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.