Method of forming dielectric on an upper substrate of a plasma display panel
US7291050B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2004 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Aug 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J9/241
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of making a plasma display panel, and more specifically, a method of forming a dielectric layer on an upper substrate of a plasma display panel. According to first embodiment of the present invention, a method of forming a dielectric layer on an upper substrate of a plasma display panel, comprises steps of: forming a plurality of sustain electrodes on the upper substrate, and bus electrodes on the sustain electrodes; forming an electrode discoloration prevention layer which envelops said sustain electrodes and said bus electrodes, said electrode discoloration prevention layer including a green sheet by first casting; forming a penetration rate enhancement layer on the electrode discoloration prevention layer, said penetration rate enhancement layer including a green sheet by second casting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.