Polishing cloth and method of manufacturing semiconductor device
US7291188B2 · kind B2 · utility
3Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Nov 23, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing cloth used in the chemical mechanical polishing treatment comprises a molded body of (meth)acrylic copolymer having an acid value of 10 to 100 mg KOH/g and a hydroxyl group value of 50 to 150 mg KOH/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.