Copper-nickel-silicon two phase quench substrate
US7291231B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
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Key dates
| Filing date | Aug 21, 2003 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Jan 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12882
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.