Patent · US Expired

Thin film deposition method and thin film deposition apparatus

US7291357B2 · kind B2 · utility

0Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 26, 2002
Grant dateNov 6, 2007
Priority date
Expiry dateJan 6, 2025

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C14/548
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A thin film deposition method for producing an optical film with an optical characteristic on a deposition substrate in a vacuum chamber is provided. The method may include preparing in the vacuum chamber a deposition source which is a source of the film producing material; holding the deposition substrate with a substrate holding member; arranging the deposition substrate and the deposition source such that, given that a vertical distance from the center of the deposition substrate to the deposition source is defined as ZK and a horizontal distance between the deposition substrate and the deposition source as Xk, Xk/Zk is set to satisfy a following equation 0.48≦Xk/Zk≦0.78; rotating the deposition substrate on a rotational axis which is orthogonal to the deposition substrate; and evaporating the film producing material of the deposition source to perform deposition on the deposition substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.