Laser enhanced plating for forming wiring patterns
US7291380B2 · kind B2 · utility
28Cited by
12References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2004 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Sep 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2804
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.