Method of forming an implantable electronic device chip level hermetic and biocompatible electronics package using SOI wafers
US7291540B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2006 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Apr 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made my producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing the dicing process to yield an individual chip. A thin-layered circuit may transmit light, allowing a photodetector to respond to transmitted light to stimulate a retina, for example. Discrete electronic components may be placed in the three-dimensional street area of the integrated circuit package, yielding a completely integrated hermetic package that is implantable in living tissue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.