Thermally stable low dielectric norbornene polymers with improved solubility and adhesion property
US7291689B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2006 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | May 1, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F232/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides norbornene-based copolymers for which one monomer is at least selected from a group consisting of norbornene and dicyclopentadiene, and the other from norbornene-based comonomers of Formula 1 shown below:In Formula 1, R1, R2 and a are defined in this specification.The present invention provides insulating elements for multi-chip packages and antireflection films for the exposure process of semiconductor fabrication using said norbornene-based copolymers. Norbornene-based copolymers according to the present invention have low dielectric constant as well as high thermal stability and excellent solubility to various organic solvents.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.