Copper paste and wiring board using the same
US7291789B2 · kind B2 · utility
0Cited by
15References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Nov 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board comprising: a conductor layer comprising Fe and Cu; and at least one of a radiator, a connection terminal, a cover and a circuit component, connected to the conductor layer through a joining member, which is obtained by coating a copper paste comprising a copper powder, an organic vehicle and an Fe2O3 particle as a conductor layer on a ceramic green sheet and firing it.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.