Downsized package for electric wave device
US7291904B2 · kind B2 · utility
4Cited by
5References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2005 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Apr 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15184
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A package substrate includes signal pads provided on a main surface of the package substrate, footpads provided on a backside of the package substrate, and a sealing electrode provided on the main surface to surround the signal pads, the signal pads being electrically coupled to the footpads, the sealing electrode being insulated from the footpads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.