Liquid-cooling heat dissipation module
US7292438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2005 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Jan 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A liquid-cooling heat dissipation module. The liquid-cooling heat dissipation module circularly dissipates heat from a heat source. The liquid-cooling heat dissipation module includes a fan, a pump, a heat sink, and a guide member. The pump is attached to the fan and driven by the fan. The heat sink is coupled to the fan, and has an opening for receiving the pump. A guide member is disposed in the opening of the heat sink and communicates with the pump. The guide member has a through hole and a guide passage formed on the surface of the guide member. Power provided by the fan, the working fluid in the liquid-cooling heat dissipation module circulates through the through hole, the pump and the guide passage to dissipate heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.