Heat sink mounting assembly
US7292443B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 3, 2006 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Oct 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink mounting assembly includes a retention module having a bottom and a pair of posts extending from the bottom. A heat sink is located on the bottom of the retention module. A clip spans across the heat sink and includes a clamping member having first and second legs releasably engaging with the posts of the retention module, and a pressing member having a first end thereof pivotably engaging with a first end of the clamping member. The pressing member has a pressing portion pressing the heat sink toward the retention module when a second end of the pressing member is depressed to engage with a pair of ears formed at a second end of the clamping member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.