High density surface mount part array layout and assembly technique
US7292450B2 · kind B2 · utility
5Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2006 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Jan 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring assembly comprising, a printed wiring board, a ball grid array coupled to the printed wiring board, and a high density surface mount part array disposed on the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.