Method of fabricating rigid flexible printed circuit board
US7293353B2 · kind B2 · utility
15Cited by
5References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Jul 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent problems occurring in the conventional method of fabricating rigid flexible PCBs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.