Method for manufacturing a fluid ejection device
US7293359B2 · kind B2 · utility
2Cited by
93References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2004 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Jun 3, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a fluid ejection device includes providing a sacrificial structure substantially overlying a semiconductor substrate. The structure has a shape configured to define an ink chamber, ink manifold, and a nozzle. The method also includes providing a first metal adjacent the sacrificial structure and substantially overlying the substrate and removing the sacrificial structure to form the ink chamber and the nozzle. The method further includes removing a portion of the first and second sacrificial materials to form the sacrificial structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.