Moldable construction incorporating bonding interface
US7294384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2006 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Sep 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/643
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite construction comprising a mat structure comprising a plurality of layers, each layer comprising plurality of fibers arranged substantially parallel to one another along a common fiber direction, a multiplicity of embedded fiber elements extending in anchored relation at least partially across the thickness dimension of the mat structure such that at least a portion of the embedded fiber elements project outwardly from the mat structure and the projecting portions define at least a partial surface covering across a first side of the mat structure, and a substrate layer disposed in layered relation to the mat structure in contacting, bonding relation with said first side of the mat structure such that at least a percentage of said portion of embedded fiber elements projecting outwardly from the mat structure is at least partially bonded or embedded into a surface portion of the substrate layer. The composite is adapted for bonding to a substrate layer. At least one interface layer disposed in layered relation to a first side of the mat structure may be included. Additional layers comprising plurality of fibers arranged substantially parallel to one another along a common …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.