Solder ball pad structure
US7294929B2 · kind B2 · utility
74Cited by
30References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2003 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Dec 30, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The inner portion of the contact pad includes a compliant layer and a conductive layer that is disposed over the compliant layer. The inner portion of the contact pad has sufficient flexibility to distribute mechanical stress applied to the contact pad and can mitigate damage to the interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.