Heat dissipation device for multiple heat-generating components
US7295437B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 3, 2005 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Nov 19, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a first heat sink (10), a second heat sink (20) and four heat pipes (30) thermally connecting the first heat sink and second heat sink. The first heat sink comprises a plurality of first heat dissipation fins (14) and the second heat sink comprises a plurality of second heat dissipation fins (24). Each heat pipe comprises an evaporating portion (32) and a condensing portion (34). The evaporating portions of two heat pipes thermally engage in a base of the first heat sink and the condensing portions thereof connect the first and second heat dissipation fins. The evaporating portions of the other two heat pipes thermally engage in a base of the second heat sink and the condensing portions thereof connect the second and first heat dissipation fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.