Electronic component mounting apparatus
US7296343B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Nov 18, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not. When both X-dimension and Y-dimension of the component measured by the image processing unit are within the tolerance, the Y-dimension measured by the image processing unit and the thickness detected by the sensor are compared and the component is judged normal when the Y-dimension is larger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.