Apparatus and method for mounting electronic components
US7296727B2 · kind B2 · utility
14Cited by
23References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Jan 26, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.