Separable ball and socket assembly for electronic device mounts
US7296771B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Feb 9, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/32737
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention provide a mounting assembly (100) for mounting an electronic device (D) to a surface (S). The mounting assembly (100) generally includes a base (102) including a mounting ball (110) and a socket assembly (104) operable to frictionally engage the ball (110) to removably couple the socket assembly (104) to the base (102). The base (102) may be removably coupled with the surface (S) and the socket assembly (104) may be removably coupled with the electronic device (D). Such a configuration enables the electronic device (D) to be easily positioned in confined environments by first attaching the base (102) to the surface (S), then attaching the socket assembly (104) to the base (102) and positioning the socket assembly (104) in a desired orientation, and finally attaching the electronic device (D) to the socket assembly (104).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.