Manufacturing process of emboss type flexible or rigid printed circuit board
US7297285B2 · kind B2 · utility
9Cited by
4References
13Claims
0Family size
Inventor
Key dates
| Filing date | Aug 5, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Apr 5, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic surface layer and the organic surface layer is solidified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.