High-temperature modeling method
US7297304B2 · kind B2 · utility
92Cited by
76References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2003 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Apr 17, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/57
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for three-dimensional modeling builds up three-dimensional objects in a heated build chamber by dispensing modeling material from a dispensing head onto a base in a predetermined pattern. Physical and thermal separation are maintained between the heated build chamber and motion control components that control the motion of the dispensing head and the base. Thermal isolation of the motion control components from the build chamber allows the chamber to be maintained at a high temperature, and has other practical advantages as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.