Systems and methods for laser-assisted plasma processing
US7297892B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2004 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Aug 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.