Semiconductor devices and manufacturing method therefor
US7298029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Apr 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.