Damped package for piezoelectric devices
US7298067B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Sep 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1071
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A packaging system for piezoelectric devices is provided that substantially reduces and avoids the deleterious effects of environmental vibrations and shocks with gas or fluid-filled chambers that drastically improve the resonator's ability to withstand unwanted disturbances and decrease or eliminate the attendant frequency shifts. The damped piezoelectric resonator packaging system combines a resonator package, a membrane and gas/fluid-filled chambers that dampen dynamic amplification of the resonator and firmly restrain the resonator within the packaging system. The selection of gas or fluid for the chamber depends upon variables such as the type of waves being propagated and interaction with the piezoelectric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.