Microdevice processing systems and methods
US7299151B2 · kind B2 · utility
1Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2004 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Oct 10, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/052
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Mircodevice processing systems. One exemplary embodiment includes a component for removing substrate material to form a feature into a first surface of a substrate, and a component for measuring a thickness of a portion of the substrate defining the feature, wherein the component for measuring is positioned proximate a second surface of the substrate that is different than the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.