Method for forming a multi-frequency surface acoustic wave device
US7299528B2 · kind B2 · utility
0Cited by
16References
7Claims
0Family size
Inventors
Key dates
| Filing date | Nov 5, 2002 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Nov 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.