Method for manufacturing an electronic module
US7299546B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Mar 20, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the to which the component (6) is attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.