Component for being subjected to high thermal load during operation and a method for manufacturing such a component
US7299622B2 · kind B2 · utility
10Cited by
24References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Jun 18, 2024 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF02K9/972
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Method and arrangement for providing a component (1) for being subjected to high thermal load during operation. The component includes a wall structure, which defines an inner space for gas flow. The component is formed by at least a first part (5) that includes an inner wall (8), an outer wall (9) and at least one cooling channel (11) between the walls. An end portion of said inner wall of the first part of the component is joined to a second part (6). The joint (18) is located at a distance from the interior of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.